SMT Manufacturing Services

We provide comprehensive SMT production solutions, including:

  • Box-build production services

  • High Mix, Low Volume (HMLV) manufacturing

  • High Volume production

All SMT processes are performed in a Class 10,000 cleanroom environment to ensure consistent product quality and stable process control. 

Major Equipment

  • Screen Printer

  • Solder Paste Inspection (SPI) System

  • Mid-Speed Chip Mounter

  • Universal Mounter

  • Reflow Oven

  • Automated Optical Inspection (AOI) System 

Daily Production Capacity

  • Line 1: 740,000 placements

  • Line 2: 400,000 placements 

Process Capabilities

PCB Size Range

  • Maximum: 400 mm × 250 mm

  • Minimum: 50 mm × 75 mm

Component Specifications

  • BGA: Minimum ball diameter 0.25 mm / ball pitch 0.45 mm

  • QFN / IC: Pitch ≥ 0.3 mm

Placement Accuracy

  • Chip accuracy / IC accuracy: ≤ ±0.03 mm

Component Size Range

  • Maximum: 150 mm × 50 mm × 12 mm

  • Minimum: 0201